JPH0461507B2 - - Google Patents
Info
- Publication number
- JPH0461507B2 JPH0461507B2 JP21372085A JP21372085A JPH0461507B2 JP H0461507 B2 JPH0461507 B2 JP H0461507B2 JP 21372085 A JP21372085 A JP 21372085A JP 21372085 A JP21372085 A JP 21372085A JP H0461507 B2 JPH0461507 B2 JP H0461507B2
- Authority
- JP
- Japan
- Prior art keywords
- external
- external lead
- welding
- contact
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21372085A JPS6273750A (ja) | 1985-09-27 | 1985-09-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21372085A JPS6273750A (ja) | 1985-09-27 | 1985-09-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273750A JPS6273750A (ja) | 1987-04-04 |
| JPH0461507B2 true JPH0461507B2 (en]) | 1992-10-01 |
Family
ID=16643877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21372085A Granted JPS6273750A (ja) | 1985-09-27 | 1985-09-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273750A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3112113B2 (ja) * | 1992-03-09 | 2000-11-27 | 三菱電機株式会社 | 半導体装置 |
| JP5041798B2 (ja) | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | 半導体装置 |
| JP5182355B2 (ja) * | 2010-12-10 | 2013-04-17 | 株式会社デンソー | 半導体装置 |
-
1985
- 1985-09-27 JP JP21372085A patent/JPS6273750A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273750A (ja) | 1987-04-04 |
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